动态离子交换法处理电子行业蚀刻含铝废酸工艺研究

doi:10.11962/1006-4990.2020-0119

Abstract

Abstract:

Wet etching and wet cleaning processes in microelectronics industry such as large-screen LCD and integrated circuits use electronic grade phosphoric acid as raw material to produce a large amount of waste phosphoric acid containing aluminum ions.The phosphoric acid waste was treated by cation exchange resin（Zminw-0705） under dynamic condition,and the influence of equipment parameters and operation parameters on adsorption effect was studied.The resin before and after adsorption was characterized by Fourier infrared spectroscopy and X-ray photoelectron spectroscopy.The model was used to fit the dynamic adsorption process.The actual adsorption capacity was close to the theoretical adsorption capacity,and the correlation coefficient was above 0.92.Results showed that under the same conditions,150∶8 was the suitable length-diameter ratio of cation exchange column;the appropriate temperature range was at 45~55 ℃;the optimal feed flow rate was 4.67 mL/min.The phosphoric acid concentration of the waste acid and aluminum ions were also within the appropriate operating range.

Key words: cation exchange resin, dynamic adsorption, model fitting, waste acid containing aluminum

CLC Number:

TQ126.35

Wu Zhaomin,Yang Lin,Wang Xinlong,Zhuang Haibo,Ye Runzhou,Wang Ye,Li Yaoji. Study on process of dynamic ion-exchange for etching waste acid containing aluminum in electronic industry[J]. Inorganic Chemicals Industry, 2021, 53(2): 61-65.

Figures/Tables 7

References 15

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序号	树脂质量/g	长径比	ρ₀/ （ mg·mL^-1）	温度/ ℃	w（磷酸）/ %	流速Q/ （ mL·min^-1）	相关系数R²	速率常数 K_TH/（ mL· （min^-1·mg^-1）	理论吸附量（q_e）_cal/ （ mg·g^-1）	实际吸附量（q_e）_exp/ （mg·g^-1）
1	4	50∶14	3	25	10	7.00	0.996	0.282	10.180	11.40
2	4	100∶10	3	25	10	7.00	0.935	0.307	16.060	16.04
3	4	150∶8	3	25	10	7.00	0.964	0.242	21.620	21.26
4	4	100∶10	6	25	10	7.00	0.997	0.136	10.680	16.56
5	4	100∶10	5	25	10	7.00	0.979	0.162	14.140	17.47
6	4	100∶10	2	25	10	7.00	0.927	0.518	16.390	17.13
7	4	100∶10	1	25	10	7.00	0.947	0.793	11.080	11.46
8	4	100∶10	3	35	10	7.00	0.982	0.289	19.250	19.28
9	4	100∶10	3	45	10	7.00	0.989	0.269	23.760	23.88
10	4	100∶10	3	55	10	7.00	0.968	0.286	21.550	22.03
11	4	100∶10	3	25	5	7.00	0.958	0.291	18.020	17.77
12	4	100∶10	3	25	15	7.00	0.955	0.332	14.880	14.50
13	4	100∶10	3	25	20	7.00	0.987	0.317	12.510	13.09
14	4	100∶10	3	25	10	2.33	0.963	0.100	23.160	23.57
15	4	100∶10	3	25	10	4.67	0.931	0.221	23.030	24.55
16	4	100∶10	3	25	10	9.32	0.974	0.311	14.730	16.10
17	4	100∶10	3	25	10	11.65	0.980	0.354	14.510	16.34

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Study on process of dynamic ion-exchange for etching waste acid containing aluminum in electronic industry

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