6063铝合金CMP中络合剂构效关系研究

doi:10.19964/j.issn.1006-4990.2023-0566

摘要/Abstract

摘要：

6063铝合金因其独特的性能，在各个行业有着广泛的应用。化学机械抛光（CMP）作为一种超精密加工技术可以实现平面全局平坦化，得到超光滑的镜面效果。为了提高6063铝合金的抛光效率，研究了不同基团（氨基、羧基）络合剂对铝合金抛光速率、表面粗糙度的影响及作用机理，利用电化学工作站及X射线光电子能谱仪（XPS）分析了不同基团络合剂对6063铝合金CMP加工影响机制。研究发现：在含双氧水的抛光液体系中，羧酸类络合剂对6063铝合金抛光性能的提高程度要大于胺类及氨基酸类络合剂，同时随着羧酸类和胺类络合剂的碳链增长，材料去除速率和表面质量均得到提高；氨基酸类络合剂表现出不同于羧酸类和胺类络合剂的规律，即随着碳链的增长，材料去除速率呈现下降的趋势。由XPS和电化学分析可知，两种不同基团络合剂的加入会在铝合金表面形成吸附层，保护铝合金表面，且长碳链的羧酸类及胺类络合剂有助于铝合金表面的腐蚀溶解，进而提高抛光速率。

关键词: 化学机械抛光, 6063铝合金, 抛光速率, 络合剂, 构效关系

Abstract:

6063 aluminum alloy has a wide range of applications in many industries because of its unique properties.Chemical mechanical polishing（CMP） is an ultra⁃precision machining technology that can achieve the global flattening of the plane and obtain an ultra⁃smooth mirror effect.In order to improve the polishing efficiency of 6063 aluminum alloy，the effects of different group（amino and carboxyl） complexing agents on the polishing rate and surface roughness of aluminum alloy and their mechanism were studied，and the influence mechanism of different group complexing agents on CMP processing of 6063 aluminum alloy was analyzed by electrochemical workstation and X-ray photoelectron spectroscopy（XPS）.It was found that the improvement of the polishing performance of 6063 aluminum alloy by carboxylic acid complexing agent was greater than that of amines and amino acids in the polishing slurry system containing hydrogen peroxide，and the removal rate and surface quality were improved with the longer carbon chain of carboxylic acid and amine complexing agent.Amino acid complexing agents exhibited different rules from carboxylic acid and amine complexing agents，and the material removal rate was decreased with the growth of carbon chains.XPS and electrochemical analysis showed that the addition of two different group complexants would form an adsorption layer on the surface of the aluminum alloy and protect the surface of the aluminum alloy.Carboxylic acids and amine complexants with long carbon chains contributed to the corrosion dissolution of aluminum alloy surfaces，thereby increasing the polishing rate.

Key words: chemical mechanical polishing, 6063 aluminum alloy, polishing rate, complexing agent, structure?performance relationship

中图分类号:

TU512.4

姜波文, 李艳沛, 芮一川, 张泽芳. 6063铝合金CMP中络合剂构效关系研究[J]. 无机盐工业, 2024, 56(8): 47-53.

JIANG Bowen, LI Yanpei, RUI Yichuan, ZHANG Zefang. Study on structure⁃performance relationship of complex agent in CMP of 6063 aluminum alloy[J]. Inorganic Chemicals Industry, 2024, 56(8): 47-53.

图/表 16

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羧酸类络合剂	腐蚀电位/ V	腐蚀电流密度/ （A·cm^-2）
OA	-0.199	-6.549
SucA	-0.211	-6.508
AA	-0.215	-6.148
SubA	-0.237	-5.752

胺类络合剂	腐蚀电位/ V	腐蚀电流密度/ （A·cm^-2）
无络合剂	-0.199	-7.053
EDA	-1.046	-5.608
BDA	-0.722	-5.458
HDA	-0.514	-5.356

氨基酸类络合剂	腐蚀电位/ V	腐蚀电流密度/ （A·cm^-2）
无络合剂	-0.199	-7.053
Gly	-0.627	-5.332
GABA	-0.554	-5.695
ACA	-0.443	-5.969

络合剂	材料去除速率 MRR/（nm·min^-1）	粗糙度 Sa/nm	腐蚀电位/ V	腐蚀电流密度/（A·cm^-2）
无络合剂	266	0.613	-0.199	-7.053
AA	350	0.150	-0.215	-6.148
HDA	344	0.351	-0.514	-5.356
ACA	314	0.269	-0.443	-5.969

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