Abstract: Chemical mechanical polishing is an important method of the silicon wafer processing and manufacturing.Chemical mechanical polishing gains lots of attention because of it makes the surface of silicon wafer more flat and precise with less damage than other traditional methods.In order to obtain a kind of grinding slurry which has a better suspension character in the future，several conventional grinding slurries′ preparation methods and these slurry′s suspension effects were summarized. The impacts of zeta potential，the types of dispersant，and other factors on the character of grinding fluid（SiC） suspension and dispersion were investigated.Finally，some existing problems and development tendency in the field of grinding slurry were pointed out.

Key words: grinding fluid, suspension, dispersant, zeta potential, silicon carbide