无机盐工业
主管:中海油天津化工研究设计院有限公司
主办:中海油天津化工研究设计院有限公司
   中海油炼油化工科学研究院(北京)有限公司
   中国化工学会无机酸碱盐专业委员会
ISSN 1006-4990 CN 12-1069/TQ
研究与开发

6063铝合金CMP中络合剂构效关系研究

  • 姜波文 ,
  • 李艳沛 ,
  • 芮一川 ,
  • 张泽芳
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  • 1.上海工程技术大学化学化工学院,上海 201620
    2.上海工程技术大学 微纳制造先进材料研究中心,上海 201620
姜波文(1999— ),男,在读硕士,主要从事半导体超精密加工的研究;E-mail:2522393082@qq.com
芮一川(1987— ),男,副教授,主要研究方向为钙钛矿太阳能电池材料;E-mail:ryc713@126.com
张泽芳(1982— ),男,副研究员,主要研究方向为金属及半导体材料的超精密加工;E-mail:zfzhang@fudan.edu.cn

收稿日期: 2023-11-28

  网络出版日期: 2024-09-26

Study on structure⁃performance relationship of complex agent in CMP of 6063 aluminum alloy

  • JIANG Bowen ,
  • LI Yanpei ,
  • RUI Yichuan ,
  • ZHANG Zefang
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  • 1.College of Chemistry and Chemical Engineering,Shanghai University of Engineering Science,Shanghai 201620,China
    2.Advanced Materials Research Center for Nano Manufacturing,Shanghai University;of Engineering Science,Shanghai 201620,China

Received date: 2023-11-28

  Online published: 2024-09-26

摘要

6063铝合金因其独特的性能,在各个行业有着广泛的应用。化学机械抛光(CMP)作为一种超精密加工技术可以实现平面全局平坦化,得到超光滑的镜面效果。为了提高6063铝合金的抛光效率,研究了不同基团(氨基、羧基)络合剂对铝合金抛光速率、表面粗糙度的影响及作用机理,利用电化学工作站及X射线光电子能谱仪(XPS)分析了不同基团络合剂对6063铝合金CMP加工影响机制。研究发现:在含双氧水的抛光液体系中,羧酸类络合剂对6063铝合金抛光性能的提高程度要大于胺类及氨基酸类络合剂,同时随着羧酸类和胺类络合剂的碳链增长,材料去除速率和表面质量均得到提高;氨基酸类络合剂表现出不同于羧酸类和胺类络合剂的规律,即随着碳链的增长,材料去除速率呈现下降的趋势。由XPS和电化学分析可知,两种不同基团络合剂的加入会在铝合金表面形成吸附层,保护铝合金表面,且长碳链的羧酸类及胺类络合剂有助于铝合金表面的腐蚀溶解,进而提高抛光速率。

本文引用格式

姜波文 , 李艳沛 , 芮一川 , 张泽芳 . 6063铝合金CMP中络合剂构效关系研究[J]. 无机盐工业, 2024 , 56(8) : 47 -53 . DOI: 10.19964/j.issn.1006-4990.2023-0566

Abstract

6063 aluminum alloy has a wide range of applications in many industries because of its unique properties.Chemical mechanical polishing(CMP) is an ultra⁃precision machining technology that can achieve the global flattening of the plane and obtain an ultra⁃smooth mirror effect.In order to improve the polishing efficiency of 6063 aluminum alloy,the effects of different group(amino and carboxyl) complexing agents on the polishing rate and surface roughness of aluminum alloy and their mechanism were studied,and the influence mechanism of different group complexing agents on CMP processing of 6063 aluminum alloy was analyzed by electrochemical workstation and X-ray photoelectron spectroscopy(XPS).It was found that the improvement of the polishing performance of 6063 aluminum alloy by carboxylic acid complexing agent was greater than that of amines and amino acids in the polishing slurry system containing hydrogen peroxide,and the removal rate and surface quality were improved with the longer carbon chain of carboxylic acid and amine complexing agent.Amino acid complexing agents exhibited different rules from carboxylic acid and amine complexing agents,and the material removal rate was decreased with the growth of carbon chains.XPS and electrochemical analysis showed that the addition of two different group complexants would form an adsorption layer on the surface of the aluminum alloy and protect the surface of the aluminum alloy.Carboxylic acids and amine complexants with long carbon chains contributed to the corrosion dissolution of aluminum alloy surfaces,thereby increasing the polishing rate.

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