Inorganic Chemicals Industry >
Study on process of dynamic ion-exchange for etching waste acid containing aluminum in electronic industry
Received date: 2020-08-18
Online published: 2021-02-06
Wet etching and wet cleaning processes in microelectronics industry such as large-screen LCD and integrated circuits use electronic grade phosphoric acid as raw material to produce a large amount of waste phosphoric acid containing aluminum ions.The phosphoric acid waste was treated by cation exchange resin（Zminw-0705） under dynamic condition,and the influence of equipment parameters and operation parameters on adsorption effect was studied.The resin before and after adsorption was characterized by Fourier infrared spectroscopy and X-ray photoelectron spectroscopy.The model was used to fit the dynamic adsorption process.The actual adsorption capacity was close to the theoretical adsorption capacity,and the correlation coefficient was above 0.92.Results showed that under the same conditions,150∶8 was the suitable length-diameter ratio of cation exchange column;the appropriate temperature range was at 45~55 ℃;the optimal feed flow rate was 4.67 mL/min.The phosphoric acid concentration of the waste acid and aluminum ions were also within the appropriate operating range.
Zhaomin Wu , Lin Yang , Xinlong Wang , Haibo Zhuang , Runzhou Ye , Ye Wang , Yaoji Li . Study on process of dynamic ion-exchange for etching waste acid containing aluminum in electronic industry[J]. Inorganic Chemicals Industry, 2021 , 53(2) : 61 -65 . DOI: 10.11962/1006-4990.2020-0119
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